Lab Circuits - Printed Circuit Board Manufacturing

PARAMETERS MANUFACTURE MULTILAYER

	CLASS 3	CLASS 4	CLASS 5	CLASS 6	CLASS 7
Minimum plated through hole diameter	0,50 mm	0,30 mm	0,30 mm	0,20 mm	0,15 mm
Minimum non plated through hole diameter	0,60 mm	0,40 mm	0,40 mm	0,30 mm	0,25 mm
Aspect / Ratio	5	5	6	8	13 (maximun thickness 2 mm)
Minimum outerlayer trace / spacing width (base copper thickness)	0,300 mm (17 µ m) 0,300 mm (35 µ m) 0,350 mm (70 µ m) 0,350 mm (105 µm)	0,200 mm (17 µ m) 0,200 mm (35 µ m) 0,250 mm (70 µ m) 0,300 mm (105 µm)	0,150 mm (17 µ m) 0,150 mm (35 µ m) 0,200 mm (70 µ m) 0,250 mm (105 µm)	0,125 mm (17 µm) 0,150 mm (35 µm) 0,175 mm (70 µm) 0,200 mm (105 µm)	0,100 mm (17 µ)
Minimum innerlayer trace / spacing width (base copper thickness)	0,250 mm (17 µ m) 0,300 mm (35 µ m) 0,300 mm (70 µ m) 0,350 mm (105 µm)	0,150 mm (17 µ m) 0,200 mm (35 µ m) 0,200 mm (70 µ m) 0,300 mm (105 µm)	0,125 mm (17 µ m) 0,150 mm (35 µ m) 0,175 mm (70 µ m) 0,250 mm (105 µm)	0,100 mm (17 µ m) 0,125 mm (35 µ m) 0,150 mm (70 µ m) 0,200 mm (105 µm)	0,075 mm (17 µ m) 0,100 mm (35 µ m)
Minimum Outer layer annular ring	0.22 mm	0.17 mm	0.13 mm	0.10 mm	0.075 mm
Minimum Signal inner layer annular ring	0.25 mm	0.22 mm	0.19 mm	0.15 mm	0.125 mm
Minimum annular spacing in ground plane	0.40 mm	0.40 mm	0.30 mm	0.25 mm	0.20 mm
Minimum microvia diameter			0,10 mm (max. thickness 0.1 mm)	0,075 mm (max. thickness 0.065 mm)	0,075 mm (max. thickness 0.065 mm)
Microvia surface pad			0.35 mm	0.30 mm	0.25 mm
Microvia landing pad			0.30 mm	0.25 mm	0.25 mm
Minimum wall between microvia and thru hole / blind/ buried			0.22 mm	0.15 mm	0.10 mm
Minimum wall between microvias			0.23 mm	0.15 mm	0.10 mm
Minimum wall between microvias in two levels			0.23 mm	0.15 mm	0.10 mm
Copper filling microvias	-	-	-	-	-
Resin filling vias/microvias	-	-		-	-

Last update: 28-04-2023
Units: Milimeters

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