MULTILAYER GENERAL TOLERANCES
| STANDARD | SPECIAL | ||
| Outer layer trace / spacing width | 
|
±20% (½ oz )
±25% (1-2 oz ) |
±10% (½ oz )
±15% (1 - 2 oz) |
| Inner layer trace / spacing width | 
|
±20% (½ - 1 oz)
±25% (2 oz) |
±10% (½ oz )
±15% (1 - 2 oz ) |
| Plated hole diameter | 
|
+4 mil / -2 mil
(or equivalent) |
+4 mil / -0,0 mil
±2 mil |
| Non plated hole diameter | 
|
+4 mil / -0,0 mil
(or equivalent) |
±1.4 mil
(or equivalent) |
| Castellated plated holes | 
|
Total thickness circuit.....................>= 0,02 mil
Cross annular ring.......... detall - A >= 0,02 mil Minimum diameter..........detall - B >= 0,02 mil Longitudinal annular...... detall - C >= 0,006 mil Annular separation.........detall - D >= 0,006 mil Edge separation..............detall - E >= 0,08 mil |
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| Backdrill |  |
Min. hole backdrill 0.5mm
More parameters see image |
- |
| Scoring to copper clearance | 
|
Min. 40 mil. | Min. 30 mil |
| Scoring positioning | 
|
± 4 mil | ± 3 mil |
| Scoring remaining thickness | 
|
± 4 mil
|
± 2 mil
|
| Board size | 
|
± 6 mil.
|
± 4 mil. |
| Total thickness tolerance | 
|
±10 % | ±5 % |
| Dielectric thickness | 
|
±10 % | ±5 % |
| Finished plated hole copper thickness | 
|
Average: 0.7 oz
Minimum: 0.6 oz |
Average: 1 oz
Minimum: 0.86 oz |
| Blind/buried plated hole copper thickness | 
|
Average: 0.4 oz.
Minimum: 0.37 oz. |
Average : 0.7 oz.
Minimum: 0.6 oz. |
| Microvia Plated hole copper thickness | 
|
Average: 0.4 oz.
Minimum:0.37 oz. |
Average: 0.7 oz.
Minimum: 0.6 oz. |
| Mínimum wall between same net plated through holes | 
|
12 mil. | 10 mil. |
| Minimum wall between different net plated through holes | 
|
16 mil. | 14 mil. |
| Minimum wall between non plated thruough holes | 
|
10 mil. | 8 mil. |
| Minimum annular ring non plated hole | 
|
10 mil.
|
8 mil. |
| Track to non plated through hole minimum spacing | 
|
8 mil. | 6 mil. |
| Track to board edge minimum spacing | 
|
8 mil. | 6 mil. |
| Offset between board edge and drill | 
|
Max. 6 mil.
|
Max. 4 mil.
|
| Offset between drill to outlayer pad | 
|
Max. 4 mil.
|
Max. 3 mil.
|
| Offset between drill to innerlayer pad |
|
Max. 6 mil. | Max. 5 mil.
|
| Offset between layers | 
|
Max. 4 mil.
|
Max. 3 mil.
|
| Soldermask feature tolerance | 
|
Max. 6 mil. | Max. 3 mil. |
| Soldermask min Damm size on fiber | 
|
SOLDERMASK GREEN COLOR
Damm 2,75mil if final copper thickness is 0.66÷2.12mil. Damm 3,35mil if final copper thickness is 2.16÷3.35mil. Damm 4,13mil if final copper thickness is 3.38÷6.10mil. SOLDERMASK COLOR BLANCO Damm 4,33mil if final copper thickness is 0.66÷2.12mil. Damm 4,33mil if final copper thickness is 2.16÷3.35mil. Other final copper thickness > 3.35mil, to consult. OTROS COLORES SOLDERMASK Damm 3,15mil if final copper thickness is 0.66÷2.12mil. Damm 3,75mil if final copper thickness is 2.16÷3.35mil. Damm 4,13mil if final copper thickness is 3.38÷6.10mil. |
-- |
| Photoimageable soldermask clearance | 
|
2.5 mil. | -- |
| Silkscreened soldermask clearance |
|
8 mil. | 6 mil. |
| Legend minimum line | 
|
5 mil. | 4 mil. |
| Conductive ink (graphite) overlapping | 
|
8 mil.
|
5 mil. |
| Conductive ink (graphite) spacing | 
|
20 mil. | 16 mil. |
| Conductive ink to pad spacing | 
|
16 mil. | 12 mil. |
| Peel-off mask overlapping | 
|
32 mil. | 20 mil. |
| Peel-off mask to pad spacing | 
|
40 mil. | 28 mil. |
| Peel-off mask to board
edge spacing |
|
40 mil. | 28 mil. |
| Maximum peel-off mask filled hole | 
|
71 mil. | 79 mil. |
| Bow and twist | |
Maxim 1% | Maxim 0,5 % |
| Insulation resistance | |
Minimum 0,5 MOhm | Minimum 2,0 MOhm |
| Continuity | |
Maxim 10 Ohms | - |
| Ionic contamination | |
Max. 0.4 µg Eq. NaCl/cm² | Max. 0.4 µg Eq. NaCl/cm² |
| Other features | |
See spec.
IPC-A-600 Rev K jul-20 |
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Last update: 12-06-2023 Units: Mils |