MANUFACTURING CAPABILITIES
| Materials | STANDARD | SPECIALIZED | |
| Materials |  |
FR4,High Tg, High frequency,PI
|
- |
| Multilayer | |
from 2 to 30 layers | - |
| PCB final thickness | |
de 32 a 126 mil | 20 and 158 mils |
| Maximum PCB size | |
22.4 x 19,7
|
23.5 x 15.5 |
| min. Trace / Space | |
3/3 mil | - |
| Base copper thickness | |
½,1,2,3 oz | - |
| min. Finished hole size | |
6 mil | - |
| Drills | |
thru-hole,blind, buried, microvia, castellated pleted holes and backdrill. | - |
| Microvies | |
3 and 4 mils | - |
| Resin filling vias/microvias | |
Taiyo THP-100DX non-conductive resin | - |
| Copper filling microvias | |
Microvia filling with copper | - |
| Scoring | |
Yes | - |
| PCB surface finish | |
IAg, ENIG , HAL Lead Free, Hal Tin Lead, Hard Gold Edge Connectors and Graphite | Immersion Tin |
| Photoimageable Solder Mask, legend and peelable ink | |
Yes | - |
| Controlled Impedance
(previous analysis design) |
|
10% | <10% |
| UL listed | |
Possible in FR4 150 and 175ºC Tg / Rigiflex | - |
| Rigiflex | |
static and dynamic. | - |
| IPCA600 | |
CLASS 2 | CLASS 3,3A * |
Last update: 06-06-2023 Units: Mils |
|